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簡(jiǎn)要描述：PNDESCRIPTIONADHESION (1)ADHESION (2)1003RBlue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, High Adhesive Strength, 139 microns thick (5 mils),supplied in 100 meter (330') rolls
更新時(shí)間：2024-06-04產(chǎn)品型號(hào)： 廠商性質(zhì)：生產(chǎn)廠家訪 問 量：1813產(chǎn)品分類
詳細(xì)介紹
PN | DESCRIPTION | ADHESION (1) | ADHESION (2) |
1003R | Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, High Adhesive Strength, 139 microns thick (5 mils),supplied in 100 meter (330') rolls without backing (typical use- wafer and ceramic dicing) | 350/520 | 370/550 |
1004R | Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium-High Adhesive Strength, 130 microns thick (5mils), supplied in 100 meter (330') rolls without backing(typical use - wafer and ceramic dicing) | 160/270 | 170/250 |
1005R | Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium-High Adhesive Strength, 125 microns thick (5mils), supplied in 100 meter (330') rolls without backing(typical use - wafer and ceramic dicing) | 90/170 | 100/150 |
1007R | Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium Adhesive Strength, 80 microns thick (3 mils),supplied in 100 meter (330') rolls without backing (typical use- wafer dicing) | 70/135 | 76/130 |
1008R | Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium-High Adhesive Strength, 80 microns thick (3mils), supplied in 100 meter (330') rolls without backing(typical use - wafer dicing) | 95/170 | 100/160 |
1009R | Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Low Adhesive Strength, 80 microns thick (3 mils),supplied in 100 meter (330') rolls without backing (typical use- wafer dicing) | 30/50 | |
1035R | Blue Adhesive Plastic Film (PVC), Silicone Release Agent-Free, Medium-High Adhesive Strength, 145 microns thick (5mils), supplied in 100 meter (330') rolls without backing(typical use - wafer dicing) | 70/73 |
(1) adhesion is measured at 30 minutes and 24hours after application to Stainless Steel, using grams per 25 mm width
(2) adhesion is measured at 30 minutes and 24hours after application to Silicon Wafer, using grams per 25 mm width
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